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Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing

GlobeNewsWire

9:00 AM | Tuesday | Oct 6, 2026

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Collaborations at Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems  Collaboration builds on the companies' long history of working together to solve complex semiconductor device scaling challenges SANTA CLARA, Calif., Oct. 06, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced it is working with Intel Corporation (Nasdaq: INTC) to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

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9:00 AM | Tuesday | Oct 6, 2026

Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing

GlobeNewsWire

Collaborations at Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems  Collaboration builds on the companies' long history of working together to solve complex semiconductor device scaling challenges SANTA CLARA, Calif., Oct. 06, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced it is working with Intel Corporation (Nasdaq: INTC) to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

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6:00 AM | Monday | Sep 28, 2026

Gunnison Copper Appoints U.S. Defense Sector Executive as Chief Financial Officer

Newsfile Corp

Phoenix, Arizona--(Newsfile Corp. - September 28, 2026) - Gunnison Copper Corp. (TSX: GCU) (OTCQB: GCUMF) (FSE: 3XS0) ("Gunnison" or the

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8:30 AM | Wednesday | Sep 9, 2026

BEEP CLOSES SERIES B TO ACCELERATE COMMERCIAL DEPLOYMENT OF AUTONOMOUS MOBILITY NETWORKS

PRNewsWire

ROUND LED BY AUTONOMOUS VEHICLE TECHNOLOGY LEADER MOBILEYE LAKE NONA, Fla., Sept. 9, 2026 /PRNewswire/ -- Beep, Inc., a leading U.S.
provider of autonomous mobility solutions, today announced the close of a Series B funding round, bringing its total capital raised to approximately $130 million.

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2:03 AM | Tuesday | Sep 8, 2026

Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV

Business Wire

MONTEREY, Calif.--(BUSINESS WIRE)--Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV.

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2:36 AM | Tuesday | Aug 11, 2026

Intel Announces Upsize and Pricing of $20 Billion Common Stock Offering

Business Wire

SANTA CLARA, Calif.--(BUSINESS WIRE)---- $INTC--Intel Corporation (Nasdaq: INTC) today announced the pricing of its previously announced registered public offering of common stock. Intel priced the underwritten public offering of 210,526,315 shares of common stock at a public offering price of $95 per share. Intel has granted to the underwriters a 30-day option to purchase up to 31,578,947 additional shares of common stock at the public offering price, less underwriting discounts. The offering was upsize.

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7:45 AM | Monday | Aug 10, 2026

Intel Announces Proposed $15 Billion Common Stock Offering

Business Wire

SANTA CLARA, Calif.--(BUSINESS WIRE)---- $INTC--Intel intends to use net proceeds from the proposed stock offering for general corporate purposes and to enable growth opportunities.

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