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Track Broadcom in real time with a live news feed covering Broadcom stock news, official press releases, company announcements, and an archive of historical Broadcom news. ...more
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9:00 AM | Wednesday | Jun 24, 2026
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Built from the ground up for current and future LLMs across the industry Developed from design to production in nine months, accelerated by OpenAI's models Will deliver performance per watt better than current state-of-the-art, based on early testing Expands OpenAI's full-stack platform, from products to models and now to chips To be deployed at gigawatt scale with data center partners, over multiple generations SAN FRANCISCO and PALO ALTO, Calif., June 24, 2026 (GLOBE NEWSWIRE) -- OpenAI and Broadcom (NASDAQ: AVGO) today unveiled Jalapeño, OpenAI's first Intelligence Processor: an accelerator architected around OpenAI's vision for the future of LLM inference, and the first AI accelerator in a multi-generation compute platform the companies are building together to make advanced AI faster, more reliable, and more accessible to more people.
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Built from the ground up for current and future LLMs across the industry Developed from design to production in nine months, accelerated by OpenAI's models Will deliver performance per watt better than current state-of-the-art, based on early testing Expands OpenAI's full-stack platform, from products to models and now to chips To be deployed at gigawatt scale with data center partners, over multiple generations SAN FRANCISCO and PALO ALTO, Calif., June 24, 2026 (GLOBE NEWSWIRE) -- OpenAI and Broadcom (NASDAQ: AVGO) today unveiled Jalapeño, OpenAI's first Intelligence Processor: an accelerator architected around OpenAI's vision for the future of LLM inference, and the first AI accelerator in a multi-generation compute platform the companies are building together to make advanced AI faster, more reliable, and more accessible to more people.
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PALO ALTO, Calif., June 11, 2026 /PRNewswire/ -- Broadcom Inc. (NASDAQ: AVGO) ("Broadcom") today announced that it has commenced cash tender offers (collectively, the "Offers") to purchase the outstanding notes described below, in each case upon the terms and subject to the conditions set forth in the Offer to Purchase dated June 11, 2026 (the "Offer to Purchase") and the accompanying notice of guaranteed delivery (the "Notice of Guaranteed Delivery").
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According to Broadcom's Private Cloud Outlook 2026 report, the private cloud is where enterprise AI workloads are being deployed for security and scale.
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EL SEGUNDO, Calif.--(BUSINESS WIRE)-- #Broadcom--The Redesign Group (Redesign) today announced it has achieved Pinnacle Partner status within the Broadcom Advantage Partner Program. Pinnacle is the highest partner tier within the program and is reserved for a select group of partners that demonstrate deep expertise, advanced technical capabilities, and a proven track record of customer success with Broadcom solutions. Pinnacle partners represent Broadcom's most strategic and highly invested partners. These.
PALO ALTO, Calif., June 08, 2026 (GLOBE NEWSWIRE) -- Today, Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, announced significant security investments for the Spring and Java ecosystem, relied on by over half of Fortune 500 companies.
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PALO ALTO, Calif., May 27, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced its collaboration with Samsung Electronics Co., Ltd. on a new, broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 System-on-Chip (SoC) with Samsung's B1320 5G Modem.
MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--FuriosaAI, a builder of high-performance inference silicon, today announced a strategic partnership with Broadcom (NASDAQ: AVGO) to develop its third-generation AI accelerator. This collaboration evolves Furiosa's Tensor Contraction Processor (TCP) architecture into a multi-die chiplet system, creating an inference engine engineered for the high-volume token requirements of global hyperscale environments. Moving beyond a traditional ASIC partnership, Furi.
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PALO ALTO, Calif., May 27, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced the expansion of its Wi-Fi 8 portfolio with a new trio of highly integrated systems-on-chip (SoC) devices: BCM6772, BCM6774, and BCM6776.
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PALO ALTO, Calif., May 26, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops, and supplies semiconductor and infrastructure software solutions, today announced the BCM68850, the industry's first 50G ITU-PON home gateway SoC featuring an integrated neural processing unit (NPU) and native Wi-Fi 8 compatibility. This launch completes the industry's most advanced wireless broadband portfolio, pairing 50G PON with a durable Wi-Fi 8 foundation established across four successive waves of market-leading innovation. This milestone underscores Broadcom's commitment to architectural consistency at the intelligent edge, offering a comprehensive range of NPU-accelerated solutions across cable, PON, Wi-Fi, and set-top box platforms to ensure a stable and resilient infrastructure for AI offloading and high-efficiency multi-gigabit workloads.
Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems Partnership will leverage Applied's global network of innovation centers, including new EPIC Center in Silicon Valley SANTA CLARA, Calif., May 20, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced that Broadcom Inc. (Nasdaq: AVGO) will join Applied's EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems.
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