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Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

GlobeNewsWire

9:00 AM | Thursday | Jun 25, 2026

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Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic New eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present SANTA CLARA, Calif., June 25, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

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9:00 AM | Thursday | Jun 25, 2026

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

GlobeNewsWire

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic New eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present SANTA CLARA, Calif., June 25, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

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10:00 AM | Wednesday | Jun 17, 2026

Applied Materials Unveils SENZ™, a Fully Integrated Visual System for Next-Gen Smart Glasses

GlobeNewsWire

SENZ will provide customers and partners with a co-optimized solution to bring high-performance augmented reality displays to market faster Groundbreaking technology will deliver world-class visual performance, seamless integration, and scalable manufacturing for next-generation smart glasses SANTA CLARA, Calif., June 17, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today unveiled SENZ™, an integrated ambient visual platform that combines waveguide optics, light engine, sensing, vision correction and electronic dimming technology in a single system designed for AI-powered next-generation display smart glasses.

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12:00 PM | Tuesday | Jun 16, 2026

EssilorLuxottica and Applied Materials Join Forces to Advance Augmented Reality Optics Platforms for Next-Generation Smart Glasses

GlobeNewsWire

PARIS and SANTA CLARA, Calif., June 16, 2026 (GLOBE NEWSWIRE) -- EssilorLuxottica and Applied Materials, Inc. today announced a long-term joint development agreement to accelerate the commercialization of next-generation intelligent optical systems for augmented reality and AI-powered smart eyewear.

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1:00 AM | Wednesday | Jun 10, 2026

Applied Materials Expands Singapore Manufacturing to Support AI Chip Demand

GlobeNewsWire

SINGAPORE and SANTA CLARA, Calif., June 09, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering solutions for the semiconductor industry, has expanded its manufacturing and R&D operations in Singapore to support the global build-out of AI infrastructure. The new US$500 million (S$600 million) Tampines Campus more than doubles Applied's advanced cleanroom capacity in Singapore and strengthens the company's global manufacturing footprint, which also includes facilities in the United States, Europe, Israel and Taiwan. The new facility, already operating at volume production, is focused on serving chipmakers that are expanding production to meet increasing AI-driven demand.

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7:35 AM | Tuesday | Jun 9, 2026

Applied Materials Announces Cash Dividend

GlobeNewsWire

SANTA CLARA, Calif., June 09, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that its Board of Directors has approved a quarterly cash dividend of $0.53 per share payable on the company's common stock. The dividend is payable on Sept.
10, 2026 to shareholders of record as of Aug. 20, 2026.

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4:05 PM | Tuesday | May 26, 2026

Applied Materials Partners with SCREEN To Bring Advanced Wafer Cleaning Technologies to EPIC Center

GlobeNewsWire

SANTA CLARA, Calif., May 26, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering solutions for the semiconductor industry, today announced that SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE), a group company of SCREEN Holdings Co.
, Ltd. (TSE: 7735), has joined the EPIC Center as its newest innovation partner. The collaboration will bring together SCREEN SPE's expertise in wafer cleaning technology with Applied's leadership in materials engineering to develop co-optimized process solutions for the world's most advanced chips.

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8:00 AM | Wednesday | May 20, 2026

Applied Materials Announces Broadcom as EPIC Innovation Partner

GlobeNewsWire

Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems  Partnership will leverage Applied's global network of innovation centers, including new EPIC Center in Silicon Valley SANTA CLARA, Calif., May 20, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced that Broadcom Inc. (Nasdaq: AVGO) will join Applied's EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems.

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9:00 AM | Monday | May 11, 2026

Applied Materials and TSMC Partner at the EPIC Center to Accelerate AI Scaling

GlobeNewsWire

Companies to work together at Applied's EPIC Center in Silicon Valley to develop materials, equipment and process technologies required to scale next-generation semiconductor devices Partnership strengthens the innovation pipeline and accelerates the transition of breakthrough technologies from research to high-volume manufacturing SANTA CLARA, Calif., May 11, 2026 (GLOBE NEWSWIRE) -- Building on more than 30 years of collaboration, Applied Materials, Inc. today announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI.

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7:30 AM | Wednesday | May 6, 2026

Applied Materials to Participate in Upcoming Investor Conferences

GlobeNewsWire

SANTA CLARA, Calif., May 06, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that members of its management team will participate in fireside chats at upcoming investor conferences.

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8:00 PM | Sunday | May 3, 2026

Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX

GlobeNewsWire

SANTA CLARA, Calif., May 03, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied's portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.

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