Applied Materials (AMAT) Business News

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Applied Materials Announces Broadcom as EPIC Innovation Partner

GlobeNewsWire

8:00 AM | Wednesday | May 20, 2026

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Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems  Partnership will leverage Applied's global network of innovation centers, including new EPIC Center in Silicon Valley SANTA CLARA, Calif., May 20, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced that Broadcom Inc. (Nasdaq: AVGO) will join Applied's EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems.

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8:00 AM | Wednesday | May 20, 2026

Applied Materials Announces Broadcom as EPIC Innovation Partner

GlobeNewsWire

Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems  Partnership will leverage Applied's global network of innovation centers, including new EPIC Center in Silicon Valley SANTA CLARA, Calif., May 20, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced that Broadcom Inc. (Nasdaq: AVGO) will join Applied's EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems.

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9:00 AM | Monday | May 11, 2026

Applied Materials and TSMC Partner at the EPIC Center to Accelerate AI Scaling

GlobeNewsWire

Companies to work together at Applied's EPIC Center in Silicon Valley to develop materials, equipment and process technologies required to scale next-generation semiconductor devices Partnership strengthens the innovation pipeline and accelerates the transition of breakthrough technologies from research to high-volume manufacturing SANTA CLARA, Calif., May 11, 2026 (GLOBE NEWSWIRE) -- Building on more than 30 years of collaboration, Applied Materials, Inc. today announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI.

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7:30 AM | Wednesday | May 6, 2026

Applied Materials to Participate in Upcoming Investor Conferences

GlobeNewsWire

SANTA CLARA, Calif., May 06, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that members of its management team will participate in fireside chats at upcoming investor conferences.

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8:00 PM | Sunday | May 3, 2026

Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX

GlobeNewsWire

SANTA CLARA, Calif., May 03, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied's portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.

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9:10 AM | Friday | May 1, 2026

Defiance Launches AMA: The First Daily 2X Long ETF for Applied Materials, Inc.

GlobeNewsWire

MIAMI, May 01, 2026 (GLOBE NEWSWIRE) -- Defiance ETFs today announced the launch of the Defiance Daily Target 2X Long AMAT ETF (AMA) , expanding its lineup of single-stock leveraged ETFs designed for active traders seeking amplified exposure to innovative growth companies. AMA is designed for traders seeking magnified, short-term bullish exposure to Applied Materials, Inc. (Nasdaq: AMAT), a leading provider of manufacturing equipment, services, and software to the semiconductor, display, and related industries.

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7:30 AM | Thursday | Apr 23, 2026

Applied Materials to Report Fiscal Second Quarter 2026 Results on May 14, 2026

GlobeNewsWire

SANTA CLARA, Calif., April 23, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that it will hold its fiscal second quarter 2026 earnings conference call on Thursday, May 14, 2026, at 4:30 p.m. ET / 1:30 p.
m. PT.

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3:30 AM | Tuesday | Apr 21, 2026

Applied Materials Announces Advantest as Innovation Partner for EPIC Platform in Silicon Valley

GlobeNewsWire

Companies will co-innovate to bridge the gap between front-end manufacturing and back-end testing of semiconductors and advanced packaging  Advantest to co-locate new, state-of-the-art Innovation Center with Applied's EPIC Center in Silicon Valley SANTA CLARA, Calif., April 21, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today announced that Advantest Corporation (TSE: 6857), a leading semiconductor test equipment supplier, will join Applied's EPIC platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster.

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3:30 AM | Tuesday | Apr 21, 2026

Advantest Announces Strategic Partnership with Applied Materials and Joins EPIC Platform

GlobeNewsWire

TOKYO, April 21, 2026 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) announced today that it will join Applied Materials' (Nasdaq: AMAT) new EPIC (Equipment and Process Innovation and Commercialization) platform in Sunnyvale, Calif. As the first automated test equipment (ATE) company to join the platform, Advantest will partner with Applied to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages.

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9:00 AM | Wednesday | Apr 8, 2026

Applied Materials Introduces Deposition Systems for Angstrom-Era Logic Chips

GlobeNewsWire

Chipmaking systems create the smallest atomic-scale features in 3D Gate-All-Around transistors Precision™ Selective Nitride PECVD preserves integrity of shallow trench isolation, reducing parasitic capacitance and boosting chip performance-per-watt Trillium™ ALD wraps silicon nanosheets with complex metal gate stacks that optimize transistors for a wide range of AI computing applications The new systems are being used by leading foundry-logic manufacturers at 2nm and beyond SANTA CLARA, Calif., April 08, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced two chipmaking systems designed to create the smallest features in the world's most advanced logic chips.

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