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Applied Materials to Participate in Upcoming Investor Conferences

GlobeNewsWire

7:30 AM | Friday | Aug 14, 2026

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SANTA CLARA, Calif., Aug. 14, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that members of its management team will participate in fireside chats at upcoming investor conferences.

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7:30 AM | Friday | Aug 14, 2026

Applied Materials to Participate in Upcoming Investor Conferences

GlobeNewsWire

SANTA CLARA, Calif., Aug. 14, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that members of its management team will participate in fireside chats at upcoming investor conferences.

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9:00 AM | Tuesday | Aug 11, 2026

UC Berkeley to Join Applied Materials' EPIC Center to Speed Chip Innovation

GlobeNewsWire

Collaboration pairs UC Berkeley's semiconductor research strength with Applied's state-of-the-art equipment and process integration expertise Located in Silicon Valley, Applied's EPIC Center provides industry-scale R&D environment with access to cutting-edge chipmaking equipment to enable rapid co-innovation and faster commercialization SANTA CLARA, Calif., Aug. 11, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that the University of California, Berkeley will join the company's EPIC Center in Silicon Valley as a research collaborator.

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7:30 AM | Thursday | Jul 23, 2026

Applied Materials to Report Fiscal Third Quarter 2026 Results on Aug. 13, 2026

GlobeNewsWire

SANTA CLARA, Calif., July 23, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that it will hold its fiscal third quarter 2026 earnings conference call on Thursday, Aug. 13, 2026, at 4:30 p.m.
ET / 1:30 p.m. PT.

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9:00 AM | Thursday | Jun 25, 2026

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

GlobeNewsWire

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip stacking for HBM and logic New eBeam systems bring wafer-fab-grade metrology and defect review to advanced packaging, optimized to handle the unique challenges these packages present SANTA CLARA, Calif., June 25, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today introduced a suite of new chipmaking systems for building the advanced 3D chip architectures that power next-generation AI.

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