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Synopsys and Intel Foundry Fast-Track Customer Readiness from Silicon to Systems on Intel 14A

PRNewsWire

9:00 AM | Monday | Jul 27, 2026

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Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die designs Key Highlights Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs: Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence From DTCO to system-aware co-optimization: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA Multi-die and advanced packaging leadership: Synopsys 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs Broad IP portfolio for faster time-to-tapeout: Interface and Foundation IP for Intel 14A — including PCIe 7.0, 224G SerDes, USB 4 and eUSB reduce integration risk and accelerate design readiness SUNNYVALE, Calif., July 27, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at the 2026 DAC Chips to Systems Conference , expanded collaborations with Intel Foundry with the certification of AI-powered EDA flows on Intel 14A process technology, advancing design enablement from design technology co-optimization (DTCO) to system-aware co-design, building on its certified and production-ready EDA flows and IP portfolio for Intel 18A and Intel 18A-P technologies.

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9:00 AM | Monday | Jul 27, 2026

Synopsys and Intel Foundry Fast-Track Customer Readiness from Silicon to Systems on Intel 14A

PRNewsWire

Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die designs Key Highlights Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs: Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence From DTCO to system-aware co-optimization: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA Multi-die and advanced packaging leadership: Synopsys 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs Broad IP portfolio for faster time-to-tapeout: Interface and Foundation IP for Intel 14A — including PCIe 7.0, 224G SerDes, USB 4 and eUSB reduce integration risk and accelerate design readiness SUNNYVALE, Calif., July 27, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced... Read more

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9:00 AM | Monday | Jul 27, 2026

Synopsys Advances Agentic AI Chip Design with AMD and Microsoft

PRNewsWire

Introduces Industry's First Autonomous EDA Workflows on Microsoft Discovery to Accelerate Engineering from Specification to Silicon Key Highlights Synopsys is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle. Introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design.

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8:45 PM | Sunday | Jul 26, 2026

Synopsys Showcases Comprehensive Autonomous Engineering Workflows from Silicon to Systems, Developed with NVIDIA Technology

PRNewsWire

New long-running, fully agentic workflows spanning EDA to CAE multiply engineering productivity Key Highlights Synopsys unveils a fully autonomous long-running design verification agent that orchestrates the entire chip verification cycle delivering up to 50X faster time-to-validated RTL while achieving 20% additional coverage improvement Demonstrating Synopsys' first fully autonomous computer-aided engineering (CAE) workflow for thermal management and electronic device cooling capable of autonomously executing set-up, pre-processing, and post-processing in a fraction of the time required for manual approaches  Expanded portfolio of more than 20 GPU-accelerated Synopsys EDA and multiphysics products, including 18X speedup of PrimeSim™ SPICE simulations SUNNYVALE, Calif., July 26, 2026 /PRNewswire/ -- Today at the 2026 DAC Chips to Systems Conference, Synopsys, Inc. (NASDAQ: SNPS) announced advancements to agentic AI for engineering in collaboration with NVIDIA.

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12:00 PM | Wednesday | Jun 17, 2026

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

PRNewsWire

Market Leaders Including Cisco, MediaTek, NVIDIA, and Samsung Foundry Demonstrate Measurable Impact, Advancing the Shift from Overdesign to Co-design Key Highlights Integrates golden signoff multiphysics analysis directly into timing signoff, design closure, multi-die, and analog workflows, enabling earlier, more accurate design decisions Enables SPICE-accurate multiphysics timing analysis with up to 3x faster runtimes Delivers up to 10x faster design closure with higher ECO success rates and improved PPA Provides concurrent power integrity, electromagnetic, and thermal analysis across dies and packaging, enabling early system-level insights from exploration to signoff SUNNYVALE, Calif., June 17, 2026 /PRNewswire/ -- Synopsys, Inc. (NASDAQ: SNPS) today announced availability of its first Multiphysics Fusion™ solutions for customer deployment.

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8:30 AM | Tuesday | Jun 2, 2026

GlobalFoundries completes acquisition of Synopsys' Processor IP Solutions Business, delivering a holistic technology platform for Physical AI

GlobeNewsWire

Combines GF's Physical AI portfolio with MIPS' RISC-V and software-to-silicon expertise to accelerate custom, software-first products for automotive, industrial and agentic edge platforms Combines GF's Physical AI portfolio with MIPS' RISC-V and software-to-silicon expertise to accelerate custom, software-first products for automotive, industrial and agentic edge platforms

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